Products

An advanced automated wire bond inspection system that integrating high resolution camera and latest technology of optics and illumination. With configurable transport options, various substrate or leadframe characteristics and sizes are reliably inspected.

A high throughput and reliable inspection on defects for various wafer types with high resolution color 2D imaging and fully automated wafer handling mechanisms.

A dual track designed handler with a high-speed inspection performance. It supports up to 6 vision systems that could boost up the inspection capabilities such as package inspection, lead inspection, cosmetic inspection, tape seal inspection and bottom tape inspection

An advanced high-throughput 3D automated optical inspection system that is specifically designed for inspecting high performance bare die products such as IGBT and FRD for automotive industry applications. It adopts ultra-high resolution camera and 3D sensor, along with the latest optics and illumination technology, to provide die surface texture and height profile.

A high speed automated optical inspection system that ideally integrating Line Scan Imaging with latest technology of optics and illumination.

The duo inspection station enable fast scanning for top and bottom substrate with the high precision gantry system. With configurable transport options, various substrate characteristics and sizes can be reliably handled